眾所周知。柔性電路板具有撓曲性和可靠性，在柔性電路板廠會對成品FPC進(jìn)行可靠性的測試，測試項目眾多，其項目名稱與英文對照如下:

  電氣性能 Testing of Electrical Performance
  導(dǎo)線電阻 Conductor Resistance
  表面層絕緣電阻 Surface Insulation Resistance (SIR)
  表面介質(zhì)層耐電壓強度 Dielectric Withstanding Voltage of Surface Layers
  機械性能測試 Testing of Mechanical Property
  剝離強度 Peel Strength
  孔和焊墊的拉脫強度 Pull-out Strength for Plain Holes and Footprints
  鍍層附著力 Plating Adhesion
  可焊性 Solderability
  耐撓曲性 Flexural Endurance
  耐彎折性 Bending Resistance
  環(huán)境性能 Environmental Performance
  溫度循環(huán) Temperature Cycling
  濕度測試 Humidity Test
  冷熱沖擊 Thermal Shock 
  鍍銅通孔的耐熱沖擊性 Thermal Shock Resistance of Copper Plated -through Holes
  遷移性 Migration
  耐化學(xué)性 Chemical Resistance
  清潔度 Cleanliness
  阻燃性 Flame Resistance
  推力測試 Shear Test 
  手機翻蓋測試 Handset Renovate Test
  窗口彎折測試 Window Bend Test
  手機滑蓋測試 Sliding Test 
  焊點拉伸強度測試 Solder Point Pull Strength Test
  鹽霧測試 Salt Fog Test
  蝕刻因子 Etching Factor 
  切片檢測 Cross Section 
  鍍層厚度 Plating Thickness
  恒溫恒濕 Constant Temperature and Humidity 
  翻折疲勞測試 Fold Fatigue Test
  安定性 Dimensional Stability
  平展性 Ductility